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Semtech、増大するデータ需要に対応する次世代データセンター、PONおよび5Gワイヤレスネットワーク向けの新製品を発表
Semtech also joins Mobile Optical Pluggable Alliance (MOPA) in commitment to advance 5G requirements in optical solutions Read more
Semtech、次世代5Gワイヤレス要件と光学ソリューションの推進を支援するMobile Optical Pluggable Allianceに参加
Semtech has joined the industry leading Mobile Optical Pluggable Alliance (MOPA) along with Coherent, Ericsson, Lumentum, Nokia and Sumitomo Electric, as the only semiconductor member Read more
Semtech Announces Production Release of Specialized FiberEdge® Solutions for Use in Optical Modules for 5G Wireless X-haul Applications
The new FiberEdge GN1300 and GN1400 transimpedance amplifiers Read more
Semtech Announces Production of Best-in-Class Reduced Pitch FiberEdge® Linear Transimpedance Amplifier for 400G and 800G Data Center Applications
Production of next generation feature-rich amplifier offers industry leading low power and low cost for very high-density single mode fiber applications Read more
Semtech Unveils FiberEdge® Octal Linear Transimpedance Amplifier for 800G and 1.6T Data Center Applications
New transimpedance amplifier (TIA) solves space challenges in 100G/lane single mode fiber space, enabling a low cost and high-performing solution in a small footprint Read more
Semtech Advances PON Leadership With Latest PON-X™ Chipset for 10G PON Optical Network Units
New products enable lower cost solutions with advanced technology Read more
Semtech Demonstrates World’s First 50G Higher Speed PON Compliant Chipset at OFC 2023
New chips expand Semtech’s PON-X™ platform for next generation multi-gigabit Fiber-to-the-X applications standards used to deliver fiber broadband services Read more
Semtech and Broadcom Demonstrate Industry’s First 200G/lane Electrical-to-Optical Link at OFC 2023
Joint collaboration among Semtech, Broadcom and Keysight accelerates N x 200G/lane deployment and supports next generation 51.2T and 102.4T switch platforms Read more
Semtech、ECOC 2022で画期的なレーンあたり200GのFiberEdge®物理媒体依存型 (PMD) チップセットのデモンストレーションを発表
1.6Tおよび3.2Tの光モジュール展開を可能し、レーンあたり200GのPAM4技術展開に道を開く新チップセット 続きを読む