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Semtech、増大するデータ需要に対応する次世代データセンター、PONおよび5Gワイヤレスネットワーク向けの新製品を発表

Semtech also joins Mobile Optical Pluggable Alliance (MOPA) in commitment to advance 5G requirements in optical solutions Read more

Semtech、次世代5Gワイヤレス要件と光学ソリューションの推進を支援するMobile Optical Pluggable Allianceに参加

Semtech has joined the industry leading Mobile Optical Pluggable Alliance (MOPA) along with Coherent, Ericsson, Lumentum, Nokia and Sumitomo Electric, as the only semiconductor member Read more

Semtech Announces Production of Best-in-Class Reduced Pitch FiberEdge® Linear Transimpedance Amplifier for 400G and 800G Data Center Applications

Production of next generation feature-rich amplifier offers industry leading low power and low cost for very high-density single mode fiber applications Read more

Semtech Unveils FiberEdge® Octal Linear Transimpedance Amplifier for 800G and 1.6T Data Center Applications

New transimpedance amplifier (TIA) solves space challenges in 100G/lane single mode fiber space, enabling a low cost and high-performing solution in a small footprint Read more

Semtech Advances PON Leadership With Latest PON-X™ Chipset for 10G PON Optical Network Units

New products enable lower cost solutions with advanced technology Read more

Semtech Demonstrates World’s First 50G Higher Speed PON Compliant Chipset at OFC 2023

New chips expand Semtech’s PON-X™ platform for next generation multi-gigabit Fiber-to-the-X applications standards used to deliver fiber broadband services Read more
Joint collaboration among Semtech, Broadcom and Keysight accelerates

Semtech and Broadcom Demonstrate Industry’s First 200G/lane Electrical-to-Optical Link at OFC 2023

Joint collaboration among Semtech, Broadcom and Keysight accelerates N x 200G/lane deployment and supports next generation 51.2T and 102.4T switch platforms Read more
Demonstration of Groundbreaking 200G per Lane FiberEdge® Physical Medium Dependent (PMD) Chipset at ECOC 2022

Semtech、ECOC 2022で画期的なレーンあたり200GのFiberEdge®物理媒体依存型 (PMD) チップセットのデモンストレーションを発表

1.6Tおよび3.2Tの光モジュール展開を可能し、レーンあたり200GのPAM4技術展開に道を開く新チップセット 続きを読む
FiberEdge® Transimpedance Amplifiers (TIA) Integrated Circuit (IC) to Enable Industry’s Best Chipset Performance for 5G Deployments

Semtech Reveals Production of FiberEdge® Transimpedance Amplifiers (TIA) Integrated Circuit (IC) to Enable Industry’s Best Chipset Performance for 5G Deployments

FiberEdge® GN1700は50GbpsのPAM4 SFP56 PAM4 5Gワイヤレス光モジュール用のリニアTIAです 続きを読む

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