回路保護アプリケーション
テクノロジー
今日の電子機器は、豊富な高性能データトランシーバー集積回路とインターフェイス（USB、HDMI、LVDS、イーサネット等）によって実現されています。消費者がより小さなフォームファクターでより高性能な電子機器を求めるようになり、これらの製品を実現するチップも同様に、より小さなプロセスジオメトリーに対応するようになります。このようにIC開発が進むにつれ、フォームファクターやプロセスノードの小型化も進んでいますが、静電気放電（ESD）の脅威による損傷やラッチアップに対するこれらのデバイスの脆弱性は増しています。
関連情報
Buildings are among the world's largest consumers of energy and one of their most underleveraged sources of operational intelligence. According to the International Energy Agency, the building sector accounts for roughly 30% of global final energy consumption and nearly 26% of global energy-related emissions. Yet the vast majority of the world's existing building stock — the millions of offices, hospitals, factories, warehouses, schools, and retail spaces that people occupy every day — remains largely unconnected. Heating runs on fixed schedules rather than occupancy. Leaks go undetected for weeks. Equipment fails without warning. Space sits unused while teams compete for meeting rooms.
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From Wired Legacy to Wireless Intelligence: How…
OFC 2026 in Los Angeles marked a defining moment for the optical and high-speed interconnect industry — and for Semtech. Held March 17–19 at the Los Angeles Convention Center, the show brought together the global optical communications ecosystem at a critical inflection point: Artificial Intelligence (AI) is fundamentally reshaping how data centers are built and the race to scale is pushing interconnect technology to move faster than anyone predicted.
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When evaluating low-power wide-area network (LPWAN) technologies for internet of things (IoT) deployments, security is no longer a checkbox, it's a fundamental design requirement. As regulations tighten and cyber threats grow more sophisticated, the question isn't just "does this technology work?" but "can I trust it with my data, my devices, and my compliance obligations?"
The answer for LoRaWAN® is a confident yes and here's why.
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LoRaWAN® Security: Enterprise-Grade Protection…
The fourth generation of LoRa® technology is revolutionizing edge intelligence with breakthrough capabilities
The Internet of Things (IoT) landscape is undergoing a fundamental transformation. As artificial intelligence (AI) and machine learning (ML) move from the cloud to the edge, IoT devices face an unprecedented challenge: how to support intelligent applications that require higher data throughput while maintaining the long battery life and extended range that make wireless sensors practical in the first place.
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LoRa Plus™が未来のAIアプリケーションを実現する仕組み
DesignCon remains the premier annual destination for engineers and technology leaders working at the cutting edge of chip-to-chip and chip-to-module interconnects — and DesignCon 2026 was no exception. For Semtech's CopperEdge™ team, this year's show delivered a powerful message: the market is moving in our direction.
From the mainstreaming of 200G per channel to the formal launch of a new industry consortium, here are the top highlights and takeaways from Santa Clara.
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DesignCon 2026: Semtech Leads the Charge Toward…
March 10 to 12, 2026 | Messe Nuremberg, Germany
Embedded World 2026, one of Europe's most anticipated technology events, brought together thousands of engineers, innovators and decision-makers at Messe Nuremberg from March 10 to 12. If there was one theme that defined the event, it was Edge AI. The story everywhere you looked was the same: intelligence at the edge, processing closer to the source and only essential data making its way to the cloud. And right at the heart of that story was LoRa®technology.
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Embedded World 2026: Edge AI Takes Center Stage…
