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Semtechが50Gフロントホールを5G-Advancedに導入
Semtech has moved its 50G mobile transport portfolio into full production, targeting the higher fronthaul capacity needed for 5G-Advanced radio networks. The semiconductor portfolio supports 10 km, 15 km bidirectional (BiDi), and wavelength division multiplexing (WDM) optical links. Read more
10 km、15 kmのBiDiおよびWDMリンク向けワイヤレストランシーバーを本格生産中
Semtech announced full production availability of its mobile transport portfolio enabling 50G fronthaul for the next wave of 5G Advanced radio deployments. Read more
Semtech、AI主導の5G-Advancedに向けた50G光移行を実現
10 km、15 kmのBiDiおよびWDMリンク向けワイヤレストランシーバーを本格生産中続きを読む
Semtech、データセンター向けNPOおよびCPOをさらに推進
AT CIOE in Shenzhen, Semtech introduced a family of 224G linear transimpedance amplifier (TIA) and drivers, designed to accelerate the deployment of Read more
Semtech、次世代モバイルフロントホールアプリケーション向け50G光製品を発表
Semtech said it has commenced production of integrated silicon subsystems intended for 50G optical transceivers in fronthaul cellular radios. A solution pairing Semtech's GN225 Clock and Data Recovery chip with the GN1700TI TIA caters to 10 km duplex radio links, while 15 km bi-directional links are served by the GN2255S CDR and GN1700TI TIA. Semtech will also market a solution pairing the GN1700TI TIA with its GN2256 CDR model, targeting WDM links and extended-reach architectures. Read more
ECOC：Semtech、12.8T光学向け200G/レーンドライバーでXPO MSAに参加
Semtech joins the XPO MSA with a portfolio of 200G/lane TIAs and Mach-Zehnder modulator drivers targeting 12.8 Tbps liquid-cooled pluggable optical modules for next-generation AI networks. Read more
Semtechは、LoRaワイヤレス技術が、太陽光パネルを超えた太陽光発電所設備、特に大規模発電施設のトラッカー、インバーター、清掃ロボットの監視にますます利用されていると述べました。
Semtech Corporation has announced its membership in the eXtra-dense Pluggable Optics Multi-Source Agreement (XPO MSA). This industry initiative aims to enable high-bandwidth AI optical interconnects for AI network infrastructure. Read more
Semtech、データセンターリンクのLPO目標を200Gに設定
Semtech has outlined power, reach and loss targets for 200G linear pluggable optics, setting out its current assumptions for data centre links. Read more
448G時代においても銅は依然として拡張性を維持できるか？
Can copper continue to scale for next-generation AI data center interconnects? Developed by TE Connectivity in collaboration with Semtech, this DesignCon 2026 Best Paper Award-winning technical paper explores passive and active copper architectures—including DAC, ACC, and Co-Packaged Copper (CPC)—and how they can help enable the transition to the 448G era. Read more
